The key to successful design in power electronics starts with the transfer of heat from different components. The thermal management involves the concept of efficiently transferring as much heat as possible away from or to the components.

The efficient heat transfer in power electronics can be achieved by using high efficient circuit boards, cooling fans, heat sinks, heat pipes, and/or external heating systems (in case to maintain higher temperature in colder conditions).

When thermal energy generated from the components exceeds the thermal energy dissipated, an additional means of cooling may be required to maintain the performance of the components. Some applications feature numerous components within a refined space and cannot efficiently dissipate enough heat then, an external heat sink or heat pipe or cooling fans is always required. The external heat sink or heat pipe is an efficient and inexpensive method of expending the surface area necessary to dissipate heat generated by the components. Specific heat sink or heat pipes materials offer higher performance due to high thermal conductivity, and a lower thermal resistance.